JAPANESE
Booth No.: E11-17
PCB mounting company of BGA trouble one shot solution
Exhibited Products / Technologies (Manufacturer)
EMS
Electronic substrate and the housing development of - production - to assembly, can be a consistent production. Of course, we also offer only of the electronic substrate production. In our company, in particular, has set a quality improvement to the goal, we specialize in production of high-density substrate of the BGA package component mounting.

JTAG Boundary scan test
Perform BGA package parts testing.
 
Company Information
Country:Japan URL:Exhibitor's Official Website
Department/Division:Sales promotion Group TEL:81-26-9263320
  
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